| Technical capability |
| Layer | 1-36L | min.board thickness（2L） | 0.3mm |
| max. size | 1500mm*610mm | min.board thickness（multi-layer） | 0.4mm |
| max.copper thickness | 5Oz | min.core thickness | 0.1mm |
| min.line width | 0.075mm |
|
|
| min.line spce | 0.076mm | min.hole positioning tolerance | ±0.05mm |
| min.hole diameter | 0.20mm | min.hole diameter tolerance | ±0.05mm |
| board bow and twist | ≤ 0.75% | min.routing tolerance | ±0.1mm |
| impedance tolerance | +/-10% | paterning positioning tolerance | +/0.075mm |
| hole copper thickness | 25um |
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| surface finish | HAL-LF, HASL, ENIG, immersion silver, gold finger, OSP |
| base material | FR-4, Hi-TG FR-4, FR-4 Halogen free, FR-4 thick copper, Aluminum based boards |
| standard lead time | Multi-layer:9wds,2L:7wds,sample:3-6wds,sample 2L: 5 wds; sample 4L: 7 wds
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