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  1. Species

    Your location:Home > Products > Species
                                                                            Capability
    Layer1-36LMin.   finished thickness(2L)0.3mm
    Max. panel size1500mm*610mm
    Min.   finished thickness(multilayer)0.4mm
    Max. Cu thickness12OZMax.   finished thickness4.0mm
    Min.Cu thickness(base)1/3OZMin.   core thickness0.1mm
    Max.Cu thickness(base)5OZDrilling   hole to hole tolerance±0.05mm
    Aspect ratio10:1Min.   hole diameter tolerance (PTH)±0.075mm
    Etching tolerance±10%Min.   hole diameter tolerance (NPTH)±0.05mm
    Min.line with0.075mm(3mil)Min.   routing tolerance±0.10mm
    Min.line space0.075mm(3mil)Min.   stamping edge to edge tolerance±0.075mm
    Min. hole diameter0.20mmV-cut   edge to edge tolerance±0.10mm(4mil)
    Board bow and twist≤   0.75%Registration(O/L)±0.05mm(2mil)
    Impedance tolerance±10%Paterning   positioning tolerance±0.075mm(3mil)
    Hole copper thickness30umMax.test   points/Board(universal ET)Jig Test Fixture:15000
        Flying Probing:1-∞
    Surface finishHAL-LF,HASL,Immersion Gold,Immersion Silever,OSP
    Base materialFR-4,   Hi-TG FR-4, Halogern free FR-4、CEM1、CEM3, Aluminum based boards
    Standard lead timeMultilayer:9   wds,2L:7wds,sample:3-6wds



    Product information
    Product name Product picture Product parameters
    PTFE laminate - Multilayer
    Traditional antenna PCB
    應用領域:LED照明

    板材:鋁基

    層數:1L

    板厚:0.8mm

    完成銅厚1OZ

    表面處理:OSP

    應用領域:LED照明

    板材:鋁基

    層數:1L

    板厚:1.2mm

    完成銅厚1OZ

    表面處理:OSP

    應用領域:LED照明

    板材:鋁基

    層數:1L

    板厚:1.5mm

    完成銅厚1OZ

    表面處理:OSP

    Application field: automotive power supply

    材質: FR4

    層數: 8L

    板厚: 2.0mm

    銅厚: 4Oz

    最小孔徑: 0.9mm

    表面處理: 無鉛噴錫

    特性: 厚銅



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